icemanjs Posted June 18, 2011 Share Posted June 18, 2011 just installed the h70 on the asus maximus board..i used artic 5 and getting 65 for idle in the bios..i cleaned the paste off the heatsink as it was used before and used the artic cleaner..i used a rice size drop of the compund on the 2600k cpu..i tried to sqush the compound on the heatsink to as i locked it down what is the right amount of paste and should i spread it on the cpu as the cooler is hard to twist like some heatsinks Link to comment Share on other sites More sharing options...
peanutz94 Posted June 19, 2011 Share Posted June 19, 2011 Check the thermal compound manufacturers webpage. Each one has their own preferred method for installing their paste and how much to use. I would also make sure that you have the cooling head properly seated down o the CPU. It almost sounds like it just isn't making full contact Link to comment Share on other sites More sharing options...
icemanjs Posted June 19, 2011 Author Share Posted June 19, 2011 Check the thermal compound manufacturers webpage. Each one has their own preferred method for installing their paste and how much to use. I would also make sure that you have the cooling head properly seated down o the CPU. It almost sounds like it just isn't making full contact i'll check..i used a size like a rice grain just dont like artic 5 much i find mx-4 better or i might try ic diamond dust...i think the heatsink just didnt spread it over as it doesnt twist much on the cpu like other heatsinks that do...will try in the morning it was a long hard build with to many issues that got fixed.. lol Link to comment Share on other sites More sharing options...
Synthohol Posted June 19, 2011 Share Posted June 19, 2011 With the triangle mark on the substrate pointing down and to the left, apply a line of thermal compound to match the red line in photo QP2. Make the line approximately 1 millimeter wide. The line of thermal compound crosses the quad or dual cores vertically as shown with the metal cap removed in photo QP3. Since heat from the CPU cores travel directly through the metal cap through the compound to the heatsink, it is much more important to have a good interface directly above the cores than it is to have the metal cap covered with compound from corner to corner. Link to comment Share on other sites More sharing options...
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