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Old 10-02-2017, 07:10 PM
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That's actually fine. The actual die that you need to cool is quite small. While you may have some thermal activity on the sides, there will be very little, especially with Intel's notoriously bad TIM. For Sandy/Ivy Bridge, however, I'd use the "line" method.
This picture shows where the die actually sits under the heat spreader. This is the area that needs the TIM:

For additional reference, here's a 'naked' Ivy Bridge CPU, clearly showing the die:
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