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Question about H110 installation on Asus Maximus Formula V


Xeeh

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So I install the backplate on, it's kind of at an angle, so I see some photos of the installation and that seems normal, but the problem that worries me is I had to install over what I believe is the Power phases, not the capacitors but the welding underneath. They're basically a short "wire" coming from underneath. It seems to fit well and works normally.. Is that normal? I could not find any other way to get around it.. I assume it would be alright or Asus would not have them where the backplates would even go.
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The back plate is plastic and non conductive ...so it's irrelevant.

 

Yes, I'm aware of that but what is relevant is the backplate possibly crushing those connections. I did use the the padding.. I assume those pins sort of sunk into..

 

Just curious if anyone else installed it over those and had issues

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There is nothing to crush on the back side of a MB . Those are just solder points and nothing to be concerned with.

 

Yeah, just concerned cause they're rather long and pointy.. but ok, if you guys say so, works for me.. thx

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You could always ground yourself and the tool you use and snip or grind them down if they are protruding too much. Usually, they don't stick out. Could be an anomaly, so you fix it.

And you can instantly void the warranty on your MB too! I wouldn't suggest this at all!

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As if anyone would be able to tell the difference, unless you totally Borked it and ground down into the traces. Just get the tall protrusions down to the solder domes. :sigh!: And, assuming that "there's nothing to crush", when pressure on a multi-layer board where it is not designed to withstand pressure can cause internal damage, is not exactly a path I would recommend taking.
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