H70 re-mounting question

[bivaughn]

Hello:

 

I've had an H70 for a few weeks in my i5 system and absolutely love it. I recently decided to move it to my X58 motherboard/i7-950 processor but had some questions before I re-mounted:

 

- After removing the cooler, the pre-applied thermal paste is uneven and the copper base is exposed. Should I smooth out the existing paste or wipe it clean and apply new paste?

 

- Removing the backplate, the adhesive on the stickers (and part of the foam as well) came apart. Do I need to get new foam stickers, or will I be fine without them?

 

Thanks,

Ben

[kkolbo]

Hello:

 

I've had an H70 for a few weeks in my i5 system and absolutely love it. I recently decided to move it to my X58 motherboard/i7-950 processor but had some questions before I re-mounted:

 

- After removing the cooler, the pre-applied thermal paste is uneven and the copper base is exposed. Should I smooth out the existing paste or wipe it clean and apply new paste?

 

- Removing the backplate, the adhesive on the stickers (and part of the foam as well) came apart. Do I need to get new foam stickers, or will I be fine without them?

 

Thanks,

Ben

 

The foam tape is just to hold it in place while you install. It is not required.

 

I cleaned my paste off with a Q tip and rubbing alcohol and applied new paste before mounting. If you have never applied paste before, do some reading first. I have never matched the performance that I got with the first install and the factory paste, but I have come very close. You really cannot reuse a paste application. It is a shame, because the original works great for me (in spite of all the folks who say it doesn't.) :p:

[bivaughn]

Thanks much. One last question:

 

- Should I apply thermal grease to the CPU, or to the H70 block (as in the factory configuration)?

 

- If to the block, do i cover the entire block?