bivaughn Posted October 24, 2010 Share Posted October 24, 2010 Hello: I've had an H70 for a few weeks in my i5 system and absolutely love it. I recently decided to move it to my X58 motherboard/i7-950 processor but had some questions before I re-mounted: - After removing the cooler, the pre-applied thermal paste is uneven and the copper base is exposed. Should I smooth out the existing paste or wipe it clean and apply new paste? - Removing the backplate, the adhesive on the stickers (and part of the foam as well) came apart. Do I need to get new foam stickers, or will I be fine without them? Thanks, Ben Link to comment Share on other sites More sharing options...
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